New types of computer memory pop up every few years as firms such as HP, IBM, Motorola/Freescale and even startups try to create alternatives that are cheaper, faster, more dense or otherwise offer a different series of trade-offs than the dominant forms of memory used today. Some will find specialty applications in embedded systems, but most are too expensive or fragile to find mainstream use cases.
What Intel and Micron are hoping with this product is that is can achieve mass popularity.
The two companies are calling their new memory 3D XPoint memory (pronounce 3D crosspoint memory) because its structure creates an lattice-like stacked layer of wires that looks like Xes when viewed from above. It combines properties of NAND Flash memory that is currently used inside solid state drives (SSDs) inside computers and phones, but it is 1,000 times faster and can last through 1,000 times more data writes.
That speed and endurance isn’t as important in your personal computer, but as SSDs are gaining use inside data centers because of their speed, both factors open up new use cases for the 3D Xpoint memory. One might be use for in-memory databases
such as those made by Oracle and SAP, where the memory is located close
to the compute. Usually in-memory databases require a lot of dynamic random access memory
(DRAM) which is co-located with the processor, but DRAM is in limited
supply and it loses everything when the power is turned off.
But
Rob Crooke, senior vice president and general manager of Intel's
Non-Volatile Memory Solutions Group, explained that because the 3D
Xpoint memory combines some of the elements of NAND and DRAM, you can
have a lot of it (10 times more than current DRAM) and it’s
non-volatile, which means that when the power goes off the data stored
in it will stick around.
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